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Process Transfer / Device Processing from Fraunhofer
 

 

 

Fraunhofer is Europe’s largest application-oriented research organization located in Germany. With decades of experience, they have many advanced technologies in semiconductor technology, devices and packaging.

  • Provides the design, sample and processing of silicon carbide power electronic devices.

  • Provide 2.5D and 3D packaging design and processing technology. Such as RDL, bump fabrication, TSV process and so on.


For detail please contact our expert:


Info@dehongmp.com

 



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