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MOT-ELECTROFORMING SYSTEM µGALV
 


ELECTROFORMING UNIT µGalv

The electroforming unit μGalv is an advanced plating tool for all kind of plating applications in the MEMS-, Semicon-, Optic- und Solar Industry. Because of the flexible arrangement and build-up of the processes including process ramp-up, the electroforming unit μGalv is the ideal tool either for industrial or R&D demands. Of course, customized solutions are available after clearing the technical details.

The MOT team has literally hundreds of combined years of experience developing ECD processes, and they are eager to help you. Our Applications Lab in Germany has all necessary tools to process wafers and measure results, therefor we can help select chemistries and advise you on options each step of the way.


ELECTROFORMING UNIT µGalv

Data sheet


Wafer Sizes: up to 300mm

Applications: Pads or Contacts, Redistribution Layer RDL, Pillar, TSV fill, MEMS,

Wafer Chip Scale Package (WCSP)




PLATING MODULES

· Overflow process consisting of a process cell and reserve tank with filtration circuit.

· Customized Chamber amount

· Electroforming of metals like Ni, Cu, Au, Ag, In

· Electroplating of alloy like NiFe, NiCo, NiW, SnPb,...

· Electro less plating of Ni, Au, SnPb,...

· Process cell build up possible as Rack Plater, Fountain tower or Flow Channel (tilted Wafer rotation)

· Pulse and Reverse Pulse Plating with minimum pulse time of 0,1 msec, optional complex wave forms like sinus, triangle etc.



RINSING MODULE

· Standard: Overflow Rinse,

· Optional: QDR, SRD



General OPTIONS

· Automatic Handling (Semi Auto, Dry in – out)

· Integration of pre/post process cells possible

· Integration of Laminar-Flow-Units

· Execution as fume hood
· Etching and Wetting Cells

· FM 4910 proofed material


BUILD-UP

· Material: PP white,

· Door material: PVC transparent,

· Pump: centrifugal pump made of PP, optional PVDF or PTFE

· Filter: PP 20“, optional PVDF/PFA

· PP plumbing, optional PVDF or PFA tube with

PFA Flaretek Fittings

· Access Panel: Touch Panel


OPERATING ELEMENTS

· All process operating elements are integrated into the front panel,

· All electrical and pneumatically components

are integrated in an independent compartment in the back-side service area,

· DIW- and N2-Spray gun integrated in the working surface


For further questions or demands, please feel free to contact us under www.mot-semicon.com or contact@m-o-t.info

M-O-T, Mikro und Oberflaechentechnik GmbH, Krughuetterstrasse 93, D-66128 Saarbruecken, Germany

© 2002-2019 by M-O-T, All Rights reserved



For detail please contact our expert:

Info@dehongmp.com




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