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ATV SRO-716 bench cabinet vacuum reflux furnace
 

SRO-716-HCOOH

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Chip welding, flip chip welding, refluxing of eutectic gold solder, bump making, device technology
peculiarity
The device integrates the various means available in vacuum reflux into one device. Provide maximum process flexibility to the user. These include:
· Low vacuum (mbar level)
· High vacuum (10-5mbar class)
· High pressure (3 atmospheres)
· formic Acid atmosphere
N2/H2 reducing atmosphere (forminggas)
· Pure hydrogen atmosphere (100%H2)
· Flux can be used.
· plasma cleaning
· Temperature control (room temperature to 450︒C, higher temperature option). Light heating, fast speed, high uniformity. Can also be heated up and down. Heating area 230x217mm (SRO700) to 314x314mm (SRO716).
· Various fixing devices to ensure that the chip does not move during the process.
· Chamber height up to 10cm to ensure that various modules can be processed.
· User special fixture.