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SINGULUS Wet Process Equipment for Semiconductor Applications
 


Wet Process Equipment for Semiconductor Applications

Manual Wet Process Stations

· Wet Systems executed for max. 12”

· Applications:

o Full lap configuration with wet stations for Cleaning, Etching, Developing, Resist Spinning, Polymer
o Processes and Solvent Processes e.g. Si-TMAH-Etch, KOH Etch, NMP Strip / Lift



· integration of 3rd party equipment (Spin-Rinse Dryers, Hotplates, Ovens)

Clear Execution and easy Access

· Clearly modular coordination to the process stations

· Modules are joined together forming a process line

· Materials according different standards (e.g. FM 4910)

· Execution according SEMI Standard




Interfaces


· Clearly positioning of the media-interfaces at the top and backside

PLC- Process control system

· Stored Programmable computer; Siemens SIMATIC S7,

· altern. Allen Bradley

Installation module

· Integration of recirculation system,

· feeding tanks, Pumps, Particle-filtration, temperature control systems,

· Heater / Chiller systems

· Dosing tanks, pipe work / shut-off valves

· Electrical- and control system installed separately area with Nitrogen/CDA flushing