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Process Transfer / Device Processing from Fraunhofer
Fraunhofer is Europe’s largest application-oriented research organization located in Germany. With decades of experience, they have many advanced technologies in semiconductor technology, devices and packaging.
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Provides the design, sample and processing of silicon carbide power electronic devices.
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Provide 2.5D and 3D packaging design and processing technology. Such as RDL, bump fabrication, TSV process and so on.
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